Maximum wafer- machining diameter of wafer | 12" |
Grinding Spindle: Bearing type Motor Rapid feed speed Grind feed speed | Air bearing, maximum 3000 rpm 5.5 kw, 4P, high frequency motor 240 mm/min 1 to 999 µm/min |
Grinding wheel size | Ø300 mm |
Index Table: Number of work spindles Work spindle Bearing type Speed of Work Spindles | 3 Air Bearing 1 to 300 rpm |
Automatic Sizing Device: Wafer thickness measuring system Wafer minimum setting size resolution Wafer size display range | 2 point contact in-process gauge,Laser Detection (Opt.) 0.1 µm 0to 1.6 mm; extended range software available |
Table Cleaning Device (Grinder side) | DI Water + Ceramic block |
Wafer Cleaning Unit (Grinder side) | DI Water + Brush |
Edge Trimming Device (Optional): Max Spindle Speed Accuracy | Recommended for < 50 um. 1800 rpm +/- 5 µm |
Number of Cassettes | 2 cassette stations |
Polish Station: Work Spindle Polish head Oscillation speed Head Load Pad size | 2High Precision Ball Bearing Work Spindles on Index Table
3Kw AC servo motor for 10 – 320 rpm 100 – 9,000 mm/min. 0 – 0.5 Kg/cm2 240mm for 300mm, 160mm for 200mm |
Polish table speed Vacuum Chuck material | 3 Kw AC servo motor for 550 rpm max Alumina ceramics + porous ceramics |
Integrated Mounter System:
Robot Vacuum Chuck Handling pads UV Irradiating Single DAF/Pre-Cut DAF Coin-Stack |
6-Axis Mitsubishi Robot Porous Carbon Fiber Vacuum Chucks Carbon Fiber Handling Pads Standard UV Irradiation system Single DAF included/Pre-Cut DAF Optional Coin-Stack Included |
