洁净干燥箱CLH系列:
By the combination of the heat-resistant filter and cooling system, clean process in high temperature and operation temperature 450 deg-C is available. The best for wafer process, optical memory disc and liquid crystal.
- Excellent heat efficiency and temperature uniformity
- The best for semiconductor wafers and glass substrate
- Inert gas introduction available
- Baking and curing for semiconductor wafers and glass substrate
- Oxygen concentration meter, signal tower, cold trap, emergency stop, water leaking
detector
| CLH series specifications | |
|---|---|
| Cleaness | CLASS100(temperature stable time) / CLASS500(up and down temperature time) |
| Oxygen concentration | Less than 20 ppm |
| System control | Programmed controller |
| Accuracy | ±0.1%FS±1digit |
| Recipes | 19 (30segment/recipe) |
| Temperature control | Auto tuning PID control |
| Shelf plate withstａnd load | 15kg/shelf |
| Chamber pressure meter | 0~2kPa |
| Filter pressure meter | 0~1kPa |
| Thermocouple | Type-K |
| Exhaust port | 1B/ball value |
| Safety feature | Electric leak breaker, heat protection, motor over-load protection, control circuit breaker, cooling water flow meter |
| Accessories | 2 shelves (with shelf plates) |
| CLH-21CD(Ⅲ) | CLH-21CDH(Ⅲ) | CLH-21CD(Ⅴ) | |
|---|---|---|---|
| Method | Convection (side-flow) | Convection rear to front | |
| Maximum temperature(*1) | 450 deg-C | 530 deg-C | 500 deg-C |
| Operation temperature(*1) | RT+70~450 deg-C | RT+70~530 deg-C | RT+70~500 deg-C |
| Temperature distribution(*2) | ±5(at 450)deg-C | ±8(at 530)deg-C | ±5(at 500)deg-C |
| Heat up time(*1) | Within 80 minutes (RT+70~450 deg-C) | Within 90 minutes (RT+70~530 deg-C) | Within 80 minutes (RT+70~500 deg-C) |
| Cool down time (Reference) | Within 90 minutes (450~100 deg-C) | Within 100 minutes (530~100 deg-C) | Within 90 minutes (500~100 deg-C) |
| Filter | Heat-resistant HEPA filter | ||
| O2 concentration | 20ppm within 45 minutes (N2⋅150L/min introduce) | ||
| Heater power | 33.6kW(at 200V) | 21kW(at 200V) | |
| Temperature recorder | 1 pen temperature recorder (control point) | ||
| Outside dimension(mm) | 1285(W)×2020(H)×1605(D) | 1180(W)×2110(H)×1670(D) | |
| Inside dimension(mm) | 670(W)×700(H)×500(D) | 700(W)×700(H)×500(D)(*3) | |
| Equipment weight | About 1050kg | About 1100kg | |
| Breaker capacity | AC 200V 150A 3 phases 50/60 Hz | AC 200V 75A 3 phases 50/60 Hz | |
| CLH-35CD(Ⅲ) | CLH-35CDH(Ⅲ) | |
|---|---|---|
| Method | Convection (Side-flow) | |
| Maximum temperature(*1) | 450 deg-C | 530 deg-C |
| Operation temperature(*1) | RT+70~450 deg-C | RT+70~530 deg-C |
| Temperature distribution(*2) | ±5 (at 450 ) deg-C | ±8 (at 530 ) deg-C |
| Heat up time (*1) | Within 70 minutes (RT+70~450 deg-C) | Within 120 minutes (RT+70~530 deg-C) |
| Cool down time (Reference) | Within 100 minutes (450~100 deg-C) | Within 120 minutes (530~100 deg-C) |
| Filter | Heat-resistant HEPA filter | |
| O2 concentration | Within 50 minutes (N2⋅250L/min introduce) | |
| Heater power | 48.3kW(at 200V) | |
| Temperature recorder | 1 pen temperature recorder (control point) | |
| Outside dimension(mm) | 1285(W)×2080(H)×1775(D) | |
| Inside dimension(mm) | 670(W)×790(H)×670(D) | |
| Equipment weight | 1250kg | |
| Breaker capacity | AC 200V 175A 3 phases 50/60 Hz | |
(*1) Heat-up available temperature is figures at control point in a heating chamber. | ||
