产品描述: MS7801压力芯片的主要组成部分是MEMS硅片。植入电阻利用压阻效应感应硅片的形变，并转换成电信号。压焊的Pyrex耐热玻璃在绝压芯片的背面形成一个密封的真空腔，玻璃的厚度分别为0.2mm（MS7801-A_0.2）和0.5mm（MS7801-A_0.5）。差压的芯片则有压焊带孔耐热玻璃（MS7801-D）和不带耐热玻璃（MS7801-S）两种。
特点:
- 量程：0~1bar（14.5psi）
- 典型线性：0.05%
- 绝压或差压
- 芯片尺寸：2.0 x 1.86 mm
- 高可靠性，低成本
压力转换
| Kpa | bar | mbar | PSI | atm | mm Hg | m H2O | Inches H2O |
| 100 | 1 | 1000 | 14.5 | 0.987 | 750 | 10.197 | 401 |
比率
| 参数 | 符号 | 条件 | 最小 | 单位 | |
| 供应电压 | VS+ | Ta=25℃ | 20 | V | |
| 储存温度 | Ts | -40 | +150 | ℃ | |
| 过压 | 5 | bar |
电气特性
(Reference conditions:Supply Voltage VS+=5Vdc; Ambient Temperature Ta=25℃)
| 参数 | 最小 | 典型 | 单位 | 备注 | |
| 工作压力范围 | 0 | 1 | Bar | ||
| 工作温度范围 | -40 | 125 | ℃ | ||
| 桥路电阻 | 3.0 | 3.4 | 3.8 | KΩ | |
| Fullscale span (FS) | 120 | 150 | 180 | mV | |
| Zero Pressure Offset | -40 | 0 | 40 | mV | |
| 线性 | ±0.05 | ±0.2 | %FS | 1 | |
Temperature Coefficient of Resistance Span Offset | +2400 -1500 -80 | +2800 -1900
| +3300 -2300 +80 | ppm/℃ ppm/℃ μV/℃ | 2 |
| 压力迟滞 | ±0.05 | ±0.15 | %FS | 3 | |
| 重复性 | ±0.05 | ±0.15 | %FS | 4 | |
| 温度迟滞 | 0.3 | %FS | 5 |
NOTES
1) Deviation at one half fullscale pressure from the least squaresbest line fit over pressure range (0 to bar).
2) Slope of the endpoint straight line from 25℃ to 60℃.
3) Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25℃.
4) Same as 3) after 10 pressure cycles
5) Maximum difference in offset after one thermal cycle from -40℃to +125℃.
订购信息
| 产品 | 类型 | 产品说明 | 编号 |
| MS7801A_0.2 | 绝压 | 1bar Pressure Sensors 0.2 mm borosilicate glasssawn on b/f | 780125022 |
| MS7801A_0.5 | 绝压 | 1bar Pressure Sensors 0.5 mm borosilicate glasssawn on b/f | 780125021 |
| MS7801-D | 差压 | 1bar Pressure Sensors sawn on b/f | 780125121 |
| MS7801-S | 差压 | 1bar Pressure Sensors no borosilicate glasssawn on b/f | 780125221 |
The MS7801dice are supplied sawn on blue foil, mounted on plastic rings.
