金属聚合-金刚石砂纸：用于较难磨的材料，如陶瓷、复合材料、硬质合金和金属复合材料
树脂聚合-金刚石砂纸：适合于多种材料，包括较硬金属和非金属涂层
这两种既可用于带背胶的标准研磨盘，也可用于支持磁性系统的磁性研磨盘。
树脂聚合-刚硬金刚石砂纸：用于粗糙/平面的韧性材料研磨。金刚石网格面积大且厚，提供更高的耐磨性，从而延长了产品的使用寿命。在金刚石网格之间距离较宽，允许水来快速冲洗碎屑、有效地帮助缩短研磨时间，减少使用量，并产生优异的样品平整度。用于硬质合金，陶瓷，坚硬的合金（维氏硬度大于150 ），和光学玻璃等材料的粗磨，特点包括：
1. 金相封装试样的平滑性和边缘保持
2. 的材料研磨力
3. 的产品寿命，降低整体成本
只支持磁性盘，砂纸背面有高抓力涂层，可防止样品在高转动下位移，厚的、刚性的不锈钢片可粘附在任何的磁性盘上。
Metal Plated
Metal plated discs are recommended for materials including
ceramics, carbides and metal matrix composites. Adhesive
back discs are also available. To order, remove 'M' from the
item number.
| Grade | 8" (200 mm) | 10" (250 mm) | 12" (300 mm) |
| 260 µm | 50-50000M | 50-50100M | 50-51000M |
| 125 µm | 50-50005M | 50-50105M | 50-51005M |
| 70 µm | 50-50010M | 50-50110M | 50-51010M |
| 30 µm | 50-50015M | 50-50115M | 50-51015M |
| 15 µm | 50-50025M | 50-50125M | 50-51025M |
| 9 µm | 50-50035M | 50-50135M | 50-51035M |
| 6 µm | 50-50040M | 50-50140M | 50-51040M |
Resin Bond
Resin bond discs are recommended for a wide variety of
materials including hard metals and nonmetal coatings.
Adhesive back discs are also available. To order, remove 'M'
from the item number.
| Grade | 8" (200 mm) | 10" (250 mm) | 12" (300 mm) |
| 80 Grit | 50-80800M | 50-81000M | 50-81200M |
| 120 Grit | 50-80805M | 50-81005M | 50-81205M |
| 220 Grit | 50-80810M | 50-81010M | 50-81210M |
| 40 µm | 50-80820M | 50-81020M | 50-81220M |
| 25 µm | 50-80825M | 50-81025M | 50-81225M |
| 9 µm | 50-80830M | 50-81030M | 50-81230M |
Resin Bond RIGID
Resin bond RIGID discs are designed for aggressive removal
of materials such as sintered carbide, ceramic, hard metals and
optical glass. They provide excellent flatness and durability.
Adhesive back discs are also available. To order, remove 'M'
from the item number.
| Grade | 8" (200 mm) | 10" (250 mm) | 12" (300 mm) |
| 120 Grit | 50-70805M | 50-71005M | 50-71205M |
| 220 Grit | 50-70810M | 50-71010M | 50-71210M |
| 600 (P-1200) Grit | 50-70820M | 50-71020M | 50-71220M |
