铂悦仪器(上海)有限公司
产品描述:
Line Card
3DIC TSV and BWS TTV硅片表面形貌测量
Film Stress薄膜应力量测仪
FEOL Electrical Characterization 电学特性
Thin wafer metrology 晶圆测量学
Film Adhesion漆膜附着力测试Global Film Stress Adhesion
Local and Lattice Stress
Thickness, Topography & Geometry
Contact and Non-Contact Sheet Resistance
Metrology Tools forSemiconductor, LED, Solar, FPD, MEMS, Data Storage
您感兴趣的产品PRODUCTS YOU ARE INTERESTED IN
仪表网 设计制作,未经允许翻录必究 .
请输入账号
请输入密码
请输验证码
请输入你感兴趣的产品
请简单描述您的需求
请选择省份