超音波扫描光学显微镜D9600Z™ C‑SAM®用以电源模块查验。 它是*早含有反过来传感器的声学光学显微镜，容许从底端扫描样版。针对很多IGBT（绝缘层栅双极三极管）模块而言，底端扫描是必需的，在其中顶端构件务必杜绝用以将超声波从传感器藕合到试品的水。D9600Z配备为根据2个环节另外查验2个模块，应用SonoMatched™传感器和WaterPlume™耦合器。将超音波单脉冲到热管散热器中，扫描传感器接受操作员挑选的原材料界面的回音。雷达回波能够在不一样的界面上开展选通，比如在将热管散热器联接到瓷器排到的焊锡丝上。因为反射面水准十分高，此深层处的间隙、无粘接、缝隙或别的空隙在声学统计数据上面显示信息为亮乳白色。优良融合的界面将是深灰色的。
实际操作工作人员可以在木筏、磨具附注、磨具或一切有关深层上设定水闸。根据应用新的Polygate™手机软件，操作员能够挑选高达100个门——每一门都将显示信息自身的声学图象。
这类多功能化大自然有利于对內部缺点开展精准剖析，并对层薄厚开展內部测定，比如应用Time Difference™模块的电焊焊接层。此软件模块还投射样版全部地域的薄厚转变，并且以图象方式显示。 Maximum Flexibility for Detailed C-SAM® Inspections of Power Modules
The D9600Z incorporates the latest C-SAM® (C-Mode Scanning Acoustic Microscope) technology with enhanced features to accommodate the testing of Power Modules as well as to performing standard C-SAM operations. This new system configuration is optimized for inspection of heatsink bond integrity, thickness of bond layer and wire bond welds. Powered by our Sonolytics™ software platform with Polygate™ technology, the D9600Z™ is ideal for failure analysis, process development and QC screening in low-volume production environments.
Features:
WaterPlume™ configuration scans from underneath, keeping the top surface of the power module dry.
Available in Dual and Single WaterPlume configurations.
Completely automated, including integrated drying of the module's bottom surface after testing.
Visual PolyGate™ technology with Multi-Gate™ and Probing-Gate™ functions to detect: o Voids in the die attach, between the die and a ceramic insulator o Voids between the ceramic substrate and the base plate o Thickness of the bond layer o Cracks, chips and other defects in the copper clad ceramic substrate o Planarity of the die, insulator (raft) and base plate (heat sink) relative to each other
